Date

wed 16 oct-fri 18 oct 2019

Lieu

Fukuoka

Pays

Japan

This year, we will exhibit at the Monozukuri Fair 2019 @ Fukuoka as our first attempt.

« Exhibited products »

For semiconductor inspection:

[Ultrasound diagnostic imaging system IS-350]

Features: A device for imaging defects inside products using ultrasound.

It can be used for wafer internal defects, power device internal defects, and IC chip quality assurance.

For non-destructive inspection:

[Non-destructive simulation software CIVA]

Features: It is possible to simulate non-destructive inspection methods. Simulation of ultrasonic testing, radiation transmission testing, eddy current testing, and guided wave testing is possible.

In particular, it can be used to solve problems in ultrasonic flaw detection, such as vertical flaw detection in UT, calculation of beam directivity of oblique flaw detection, calculation of sound field, calculation of delay row of phased array probe, probe design.

Other:

Introducing our products.

Date: October 16 (Wednesday)-October 18 (Friday), 10: 00-17: 00 (until 16:00 on the last day)