IS-350 Standard Scanner

Maker:Insight k.k.

The IS-350 is the versatile workhorse in the InsightScan family of acoustic microscopes. Its large sample holder and scan area, high spatial resolution, fast acquisition speed and large bandwidth make it a powerful lab instrument for high resolution R&D applications and at the same time a perfectly suitable instrument for high volume quality control in production environment.


Scan area Size: 350 x 350 mm
Resolution: 0.5 µm
Focus axis Stroke: 50 mm
Resolution: 0.5 µm
Data collection system Fully digital
Scan speed Up to 900 mm/sec
Pulser/receiver bandw. 0.5 … 500 MHz
Drive system X-axis: Linear servo motor   
Y-axis: Stepper motor
Z-axis: Stepper motor
Data sampling rate
Up to 4 GHz
Size (W x D x H) 680 x 800 x 1320 mm






Powerful scan technology

  • High speed technology: 900 mm/sec scan speed, 500 MHz receiver bandwidth, up to 4 GHz data sampling rate
  • Dual channel data acquisition for minimizing the acquisition time on one sample, or for simultaneous data acquisition on 2 different samples
  • Simultaneous pulse-echo and through transmission acquisition supported
  • Optional turntable sample holder available

Advanced software features

  • Real time full waveform acquisition: Collected data allow offline rescanning of the sample with different gate settings
  • Advanced analysis features: Generation of virtual B-scans and tomographic C-scans from stored data files
  • Slice scan for acquisition of a virtually unlimited number of C-scans on different depth levels simultaneously
  • Multi-lingual software in English, Japanese, Chinese, French, German, …


Wide application range

           Semiconductor and microelectronics

  • CSP and Flip Chip underfil void evaluation and delamination analysis
  • Power semiconductor integrity evaluation
  • Internal defect inspection: Inclusions, cracks, die tilt
  • Interface evaluation of bonded wafers

Material analysis

  • Inclusion, crack and void detection in metals, plastics, resin

Interface analysis

  • Void evaluation in welds and brazed interfaces
  • Electrostatic chuck void detection
  • Delamination of composite materials
  • Interface analysis on heterogeneous assembled materials