Maker：Insight k.k.

The IS-350 is the versatile workhorse in the InsightScan family of acoustic microscopes. Its large sample holder and scan area, high spatial resolution, fast acquisition speed and large bandwidth make it a powerful lab instrument for high resolution R&D applications and at the same time a perfectly suitable instrument for high volume quality control in production environment.

 

Scan area	Size: 350 x 350 mm
	Resolution: 0.5 µm
Focus axis	Stroke: 50 mm
	Resolution: 0.5 µm
Data collection system	Fully digital
Scan speed	Up to 900 mm/sec
Pulser/receiver bandw.	0.5 … 500 MHz
Drive system	X-axis: Linear servo motor
	Y-axis: Stepper motor
	Z-axis: Stepper motor
Data sampling rate	Up to 4 GHz
Size (W x D x H)	680 x 800 x 1320 mm

 

 

 

 

 

Powerful scan technology

• High speed technology: 900 mm/sec scan speed, 500 MHz receiver bandwidth, up to 4 GHz data sampling rate
• Dual channel data acquisition for minimizing the acquisition time on one sample, or for simultaneous data acquisition on 2 different samples
• Simultaneous pulse-echo and through transmission acquisition supported
• Optional turntable sample holder available

Advanced software features

• Real time full waveform acquisition: Collected data allow offline rescanning of the sample with different gate settings
• Advanced analysis features: Generation of virtual B-scans and tomographic C-scans from stored data files
• Slice scan for acquisition of a virtually unlimited number of C-scans on different depth levels simultaneously
• Multi-lingual software in English, Japanese, Chinese, French, German, …

 

Wide application range

           Semiconductor and microelectronics

• CSP and Flip Chip underfil void evaluation and delamination analysis
• Power semiconductor integrity evaluation
• Internal defect inspection: Inclusions, cracks, die tilt
• Interface evaluation of bonded wafers

           Material analysis

• Inclusion, crack and void detection in metals, plastics, resin

           Interface analysis

• Void evaluation in welds and brazed interfaces
• Electrostatic chuck void detection
• Delamination of composite materials
• Interface analysis on heterogeneous assembled materials